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Obviously you haven't read the manufacturers information either. You
are in good company. http://images.formica.com/assets/pdf...acktechBrf.pdf "Basically, the stronger and more rigid the bond, the less are the chances for stress cracking. Contact adhesives, by their nature, are elastomeric and, therefore, transfer less of the stress to the substrate. Assemblies made with contact adhesives, therefore, are less crack resistant than those fabricated with rigid or semi-rigid adhesives." Pete, you may also be interested in the other note which is included in all the other info: "Plywood substrates should be avoided, whenever possible, for use with Formica brand laminate, and should never be used as a substrate for ColorCore surfacing material. Because of its cross-ply construction, plywood expands and shrinks less than either of these laminate grades. This results in greater stress built up within the laminate, and thereby increases the chance of stress cracking." Shawn "Lew Hodgett" wrote in message ink.net... | pete wrote: | Hi all, | I am just about to bond some formica (plastic laminate) to plywood | using epoxy. | | Why reinvent the wheeel? | | Why not just use the standard contact cement designed specifically to | bond laminate? | | Lew |
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