Obviously you haven't read the manufacturers information either. You
are in good company.
http://images.formica.com/assets/pdf...acktechBrf.pdf
"Basically, the stronger and more rigid the bond, the less are the
chances for stress cracking. Contact adhesives, by their nature, are
elastomeric and, therefore, transfer less of the stress to the
substrate. Assemblies made with contact adhesives, therefore, are less
crack resistant than those fabricated with rigid or semi-rigid
adhesives."
Pete, you may also be interested in the other note which is included
in all the other info:

"Plywood substrates should be avoided, whenever possible, for use with
Formica brand
laminate, and should never be used as a substrate for ColorCore
surfacing material.
Because of its cross-ply construction, plywood expands and shrinks
less than either of
these laminate grades. This results in greater stress built up within
the laminate, and
thereby increases the chance of stress cracking."

Shawn

"Lew Hodgett" wrote in message
ink.net...
| pete wrote:
| Hi all,
| I am just about to bond some formica (plastic laminate) to plywood
| using epoxy.
|
| Why reinvent the wheeel?
|
| Why not just use the standard contact cement designed specifically
to
| bond laminate?
|
| Lew